CoWoS Anti-Static Vacuum Pen for Advanced Packaging Processes

Key Advantages

1. Chip Surface Protection
Specifically designed for advanced packaging processes, providing excellent cushioning to protect delicate chip surfaces.

2. Prevention of Mechanical Damage
Made with a specially selected sponge material to effectively prevent scratches during chip handling and placement.

3. Compliance with Stringent Technical Requirements
Features ESD protection with a resistance of 10⁶–10⁹ Ω and complies with RoHS, fully meeting the stringent requirements of CoWoS processes.

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